Electronic device

ABSTRACT

An electronic device including a plurality of pixels and a driving element is provided. Each of the plurality of pixels includes a first sub-pixel, a second sub-pixel, and a third sub-pixel. The driving element drives each first sub-pixel of the plurality of pixels.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation application of a prior applicationSer. No. 17/894,170, filed on Aug. 24, 2022, which claims the prioritybenefit of China application serial no. 202111166184.5, filed on Sep.30, 2021. The entirety of the above-mentioned patent application ishereby incorporated by reference herein and made a part of thisspecification.

BACKGROUND Technical Field

The disclosure relates to an electronic device, and particularly relatesto an electronic device with a light-sensing element.

Description of Related Art

Display panels are important elements in various electronic devices. Inorder to allow various functions of an electronic device to beintegrated, the display panel may be designed to be integrated ormatched with other elements. For example, the display panel may beassembled with a light-sensing element, and the light-sensing elementmay be designed to be located under the screen, so that the display arearatio of the product increases. In such a design, the light-sensingelement is arranged on the back side of the display panel, and theregion in the display region of the display panel corresponding to thelight-sensing element is designed as a transparent region, so that thelight-sensing element may receive light through the transparent region.How to balance the light-transmitting effect of the transparent regionand the display effect of the overall display panel is an importantissue.

SUMMARY

The disclosure is directed to an electronic device capable of providinga uniform display effect as sell as a sufficient light-transmittingeffect.

An embodiment of the disclosure provides an electronic device includinga plurality of pixels and a driving element. Each of the plurality ofpixels includes a first sub-pixel, a second sub-pixel, and a thirdsub-pixel. The driving element drives each first sub-pixel of theplurality of pixels.

To make the aforementioned more comprehensible, several embodimentsaccompanied with drawings are described in detail as follows.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the disclosure, and are incorporated in and constitutea part of this specification. The drawings illustrate embodiments of thedisclosure and, together with the description, serve to explain theprinciples of the disclosure.

FIG. 1 is a schematic diagram of an electronic device according to anembodiment of the disclosure.

FIG. 2 is a schematic diagram of a display region of a display panelaccording to an embodiment of the disclosure.

FIG. 3 is a partial schematic diagram of an array substrate according toan embodiment of the disclosure.

FIG. 4A is a schematic cross-sectional view of the array substrate ofFIG. 3 taken along a line A-A′, a line B-B′, and a line C-C′ in someembodiments.

FIG. 4B is a schematic cross-sectional view of the array substrate ofFIG. 3 taken along a line I-I′ and a line II-II′ of FIG. 3 in someembodiments.

FIG. 5 is a partial schematic diagram of an array substrate according toan embodiment of the disclosure.

FIG. 6 is a schematic diagram of a cross-sectional structure of thearray substrate of FIG. 5 taken along a line D-D′, a line E-E′, and aline F-F′ in some embodiments.

FIG. 7 is a schematic diagram of some elements of a counter substrateaccording to an embodiment of the disclosure.

FIG. 8 is a partial schematic diagram of an array substrate according toan embodiment of the disclosure.

FIG. 9 is a schematic diagram of some elements of a counter substrateaccording to an embodiment of the disclosure.

FIG. 10 is a schematic diagram of a cross-sectional structure of thearray substrate of FIG. 8 taken along a line G-G′ and a line H-H′ insome embodiments.

FIG. 11 is a schematic diagram of partial film layers of thecross-sectional structure of the array substrate of FIG. 8 taken alongthe line G-G′ and the line H-H′ in some embodiments.

FIG. 12 is a schematic diagram of an electronic device according to anembodiment of the disclosure.

DESCRIPTION OF THE EMBODIMENTS

Reference will now be made in detail to the present preferredembodiments of the disclosure, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numbers areused in the drawings and the description to refer to the same or likeparts.

In the disclosure, when one structure (or layer, element, substrate) isdescribed to be located on another structure (or layer, element,substrate), it means that the two structures are adjacent and directlyconnected (or contacted), or means that the two structures are adjacentbut not directly connected (or contacted). Indirect connection meansthat there is at least one intermediate structure (or intermediatelayer, intermediate component, intermediate substrate, intermediatespace) between the two structures, and a lower surface of one structureis adjacent or directly connected to an upper surface of theintermediate structure, and an upper surface of the other structure isadjacent or directly connected (or contacted) to a lower surface of theintermediate structure, and the intermediate structure may be composedof a single layer or multi-layer solid structure or non-solid structure,which is not limited by the disclosure. In the disclosure, when acertain structure is disposed “on” another structure, it may mean thatthe certain structure is “directly” on the another structure, or thatthe certain structure is “indirectly” on the another structure, i.e., atleast one structure is sandwiched between the certain structure and theanother structure.

The electrical connection or coupling described in the disclosure mayrefer to direct connection or indirect connection. In the case of directconnection, terminals of components on two circuits are directlyconnected or connected to each other by a conductor line segment, and inthe case of indirect connection, there are switches, diodes, capacitors,inductors, resistors, other suitable components, or a combination of theabove-mentioned components between the terminals of the components onthe two circuits, but the disclosure is not limited thereto.

In the disclosure, the measurement methods of thickness, length andwidth may be implemented by using an optical microscope, and thethickness may be measured according to a cross-sectional image in anelectron microscope, but the disclosure is not limited thereto. Inaddition, any two values or directions used for comparison may havecertain errors. If a first value is equal to a second value, it impliesthat there may be an error of about 10% or 5% or 3% between the firstvalue and the second value.

It should be noted that, in the following embodiments, features inseveral different embodiments may be replaced, recombined, and mixed tocomplete other embodiments without departing from the spirit of thedisclosure. As long as the features of the various embodiments do notviolate the spirit of the disclosure or conflict with each other, theymay be mixed and matched arbitrarily.

FIG. 1 is a schematic diagram of an electronic device according to anembodiment of the disclosure. An electronic device 10 of FIG. 1 includesa display panel 12 and a light-sensing element 14. The display panel 12has a display side 12A and a back side 12B opposite to each other. Thedisplay side 12A of the display panel 12 may present an image to bedisplayed, and the light-sensing element 14 is located at the back side12B of the display panel 12. To be specific, the display panel 12 mayhave a display region RD, and the display region RD may be divided intoa transparent region R1 and another region R2 other than the transparentregion R1 according to a distribution of light transmittance. Thetransparent region R1 may be regarded as a partial region of the displayregion RD with higher light transmittance. The entire display region RDmay be used to present an image, so that the transparent region R1 is aregion that may be used to present the image and has a certain lighttransmittance. In the electronic device 10, an arrangement position ofthe light sensing component 14 substantially corresponds to thetransparent region R1. In this way, light may pass through thetransparent region R1 and may be received by the light-sensing element14. According to some embodiments, the light-sensing element 14 mayinclude an image acquisition component, such as a camera. In this case,light from an object 16 on the display side 12A may pass through thetransparent region R1 and may be received by the light-sensing element14, thereby allowing the light-sensing element 14 to acquire an image ofthe object 16. In FIG. 1 , the transparent region R1 is substantiallylocated at an edge of the display region RD and an edge of thetransparent region R1 is substantially coincided with the edge of thedisplay region RD, but the disclosure is not limited thereto. In otherembodiments, the transparent region R1 may be located in any part of thedisplay region RD, and the transparent region R1 may be completelysurrounded by the another region R2 of the display region RD. Accordingto some embodiments, the light-sensing element 14 may include abiometric component, such as a fingerprint recognition component, andthe object 16 may be a biological feature (such as a finger).

FIG. 2 is a schematic diagram of a display region of the display panel12 according to an embodiment of the disclosure. In FIG. 2 , the displayregion RD of the display panel may include the transparent region R1 andthe another region R2. Shown as a partial enlarged view of FIG. 2 , FIG.2 schematically shows that the display panel may include a plurality ofpixel blocks PX in the display region RD, and the pixel blocks PX may bedivided into pixel blocks PX1 located in the transparent region R1 andpixel blocks PX2 located in the another region R2 according to adistribution region. The display panel 12 is provided with a pluralityof pixels P1 in the pixel block PX1 of the transparent region R1, andprovided with a plurality of pixels P2 in the pixel block PX2 of theanother region R2. According to some embodiments, as shown in FIG. 2 ,four pixels P1 are configured in each pixel block PX1 of the transparentregion R1, and four pixels P2 are configured in each pixel block PX2 ofthe another region R2. However, the design of four pixels forming thepixel block is only used for illustration, and the disclosure is notlimited thereto.

In other embodiments, the number of pixels in each pixel block PX is notlimited, which may be adjusted according to different designrequirements.

As shown in FIG. 12 , the electronic device 10 includes a display panel12. The display panel 12 may include an array substrate 100A and acounter substrate 100S2. The array substrate 100A and the countersubstrate 100S2 may be disposed opposite to each other. FIG. 2 roughlyshows the arrangement of the pixels P1 in the transparent region R1, butdoes not show some components such as a light-shielding layer on thecounter substrate 100S2. FIG. 7 further shows the specific arrangementpositions of the pixels P1 in the transparent region R1 on the countersubstrate 100S2. FIG. 7 is a top view of the counter substrate 100S2corresponding to the transparent region R1 of the display panel 12according to some embodiments. To be specific, as shown in FIG. 7 , thecounter substrate 100S2 includes a light-shielding layer 170 and a colorfilter layer 180. As shown in FIG. 7 , a transparent portion RT in thetransparent region R1 is a portion other than the light-shielding layer170 and the color filter layer 180. In some embodiments, an area ratioof the transparent portion RT in each pixel block PX1 may be adjustedaccording to actual requirements of different devices. For example, insome embodiments, the area ratio of the transparent portion RT in eachpixel block PX1 may be between 30% and 80%, for example, between 50% and70%, but the disclosure is not limited thereto. In other embodiments,the area ratio of the transparent portion RT may be adjusted accordingto different design requirements.

As shown in FIG. 2 and FIG. 7 , according to some embodiments, in thetransparent region R1, each pixel P1 may include a first sub-pixel P1A,a second sub-pixel P1B, and a third sub-pixel P1C, while in the anotherregion R2, each pixel P2 may include a first sub-pixel P2A, a secondsub-pixel P2B, and a third sub-pixel P2C. The first sub-pixel P1A, thesecond sub-pixel P1B, and the third sub-pixel P1C may be used to presentdifferent colors of display light, and the first sub-pixel P2A, thesecond sub-pixel P2B, and the third sub-pixel P2C may be used to presentdifferent colors of display light. In some embodiments, the displaylights of different colors presented by different sub-pixels may be, forexample, red, green and blue light, but the disclosure is not limitedthereto. In other embodiments, the colors of the display light may beadjusted according to different design requirements.

As shown in FIG. 7 , the light-shielding layer 170 has a plurality ofopenings P170, and the sub-pixels may be defined by the openings P170 ofthe light-shielding layer 170. For example, at the lower left of FIG. 7, the three openings of the light-shielding layer 170 define the firstsub-pixel P1A, the second sub-pixel P1B, and the third sub-pixel P1C. Indetail, the color filter layer 180 may include a first color filterpattern 182, a second color filter pattern 184 and a third color filterpattern 186, which respectively have different colors. In thetransparent region R1 of the counter substrate 100S2, the first colorfilter pattern 182, the second color filter pattern 184 and the thirdcolor filter pattern 186 may be respectively disposed in thecorresponding openings P170 of the light-shielding layer 170. In thisway, the first color filter pattern 182, the second color filter pattern184 and the third color filter pattern 186 may jointly achieve afull-color display effect. Namely, the first sub-pixel P1A, the secondsub-pixel P1B and the third sub-pixel P1C may jointly achieve thefull-color display effect. Regarding the pixel P2 in the another regionR2 shown in FIG. 2 , the first sub-pixel P2A, the second sub-pixel P2Band the third sub-pixel P2C may be similarly defined by the openings ofthe light-shielding layer in the another region R2, and detail thereofis not repeated.

Referring to FIG. 2 and FIG. 7 together, a pixel space SP1 may be adistance between two adjacent sub-pixels of the same color.Specifically, as shown in FIG. 7 , for example, the first sub-pixel P1A,the second sub-pixel P1B, and the third sub-pixel P1C may berespectively red (marked as R), green (marked as G), and blue (marked asG). A distance along one direction (for example, a first direction D1)between two adjacent sub-pixels P1A and P1A′ that are both red isdefined as the pixel space SP1. The first direction D1 may be anextending direction of a signal line 132 (scan line) (as shown in FIG. 3). The above-mentioned first sub-pixel P1A, second sub-pixel P1B, andthird sub-pixel P1C being respectively red, green, and blue are regardedas illustrative only and not as restrictive. Similarly, as shown in FIG.2 , a pixel space SP2 in the another region R2 may be a distance betweentwo adjacent sub-pixels of the same color. Specifically, a distancealong the first direction D1 between two adjacent sub-pixels P2A andP2A′ that are both red is defined as the pixel space SP2, and detailthereof is not repeated.

As shown in FIG. 2 , according to some embodiments, in one pixel P1, thefirst sub-pixel P1A, the second sub-pixel P1B, and the third sub-pixelP1C may be aligned along the first direction D1. According to otherembodiments (although not shown in the figure), in one pixel P1 , thefirst sub-pixel P1A, the second sub-pixel P1B, and the third sub-pixelP1C may not be aligned along the first direction D1. As shown in FIG. 2, according to some embodiments, the first sub-pixels P1A, the secondsub-pixels P1B, and the third sub-pixels P1C of two adjacent pixels P1in the second direction D2 are aligned along the second direction D2.According to other embodiments (although not shown in the figure), thesub-pixels of two adjacent pixels P1 in the second direction D2 may bemisaligned along the second direction D2. The arrangement of pixels andsub-pixels may be designed according to actual requirements, which isnot intended to limit the disclosure.

As shown in FIG. 2 , according to some embodiments, the pixel space SP1in the transparent region R1 may be substantially equal to the pixelspace SP2 in the another region R2. In this way, the transparent regionR1 and the another region R2 may maintain a substantially sameresolution, and the display panel 12 may display approximately similarimage effects in the transparent region R1 and the another region R2. Assuch, poor display effects caused by inconsistent pixel spaces indifferent regions may not be provided, and local display granularsensation that may be generated in the transparent region R1 isprevented from occurring. Moreover, under the condition that thetransparent region R1 and the another region R2 maintain the same pixelspace, a pixel (or sub-pixel) size in the transparent region R1 issmaller, so that a transparent portion RT may be vacated. Therefore,according to some embodiments, an area of the pixel P1 in thetransparent region R1 may be different from an area of the pixel P2 inthe another region R2. For example, the area of the pixel P1 may besmaller than the area of the pixel P2.

As shown in FIG. 2 and FIG. 7 , since the transparent region R1 also hasthe pixels P1, both of the transparent region R1 and the another regionR2 may be used for displaying images. In the prior art, thelight-sensing element 14 is usually disposed in a region without thedisplayed image, so that the display panel 12 has a smaller displayarea. Compared with the prior art, according to some embodiments, asshown in FIG. 1 , the light-sensing element 14 is disposed at theposition of the transparent region R1 of the display panel 12, and thetransparent region R1 also has the pixels P1 to display images.Therefore, a full-screen display effect may be achieved withoutsacrificing a display area. Furthermore, due to the existence of thetransparent portion RT, the transparent region R1 may have a higherlight transmittance than the another region R2, so that by applying thetransparent region R1 in the electronic device 10 of FIG. 1 , thelight-sensing element 14 may receive light of the display side 12A.

As shown in FIG. 1 , the electronic device 10 includes the display panel12. As shown in FIG. 12 , the display panel 12 may include an arraysubstrate 100A (as shown in FIG. 3 ) and a counter substrate 100S2 (asshown in FIG. 7 ). The array substrate 100A and the counter substrate100S2 may be disposed opposite to each other. A structure of the arraysubstrate 100A in the electronic device 10 is described in detail below.FIG. 3 is a partial schematic diagram of the array substrate 100Aaccording to an embodiment of the disclosure. To be specific, FIG. 3shows a pixel block of the display panel 12 in the transparent region,and the structure shown in FIG. 3 may be used as one of theimplementations of the pixel blocks PX1 in the transparent region R1 ofFIG. 2 , but the disclosure is not limited thereto. In FIG. 3 , thearray substrate 100A in the electronic device 10 may include a pluralityof pixels 110 and a driving element 120, where the pixels 110 may beused as an implementation of the pixels P1 in FIG. 2 , but thedisclosure is not limited thereto. Each of the plurality of pixels 110includes a first sub-pixel 112, a second sub-pixel 114 and a thirdsub-pixel 116, and the driving element 120 may be used to drive thefirst sub-pixel 112 of each of the plurality of pixels 110. Namely, thedriving element 120 may drive the plurality of first sub-pixels 112.Therefore, according to some embodiments, in the array substrate 100A,the number of the driving elements may be reduced, and the number ofsignal lines connected to the driving elements may also be reduced. Inthis way, an area of the light-shielding layer in the counter substrate100S2 may be reduced, so that the area of the transparent portion RT maybe increased, and the light transmittance of the transparent region R1in the electronic device may be improved. In some embodiments, the pixelblock PX1 may be provided with a plurality of driving elements accordingto the number of the sub-pixels of each pixel 110. For example, thepixel 110 in FIG. 3 is composed of three sub-pixels of the firstsub-pixel 112, the second sub-pixel 114 and the third sub-pixel 116, andthe number of the driving elements 120 may be three, which respectivelydrive the first sub-pixel 112, the second sub-pixel 112 and the thirdsub-pixel 116. In addition, in this embodiment, the description of thedriving element 120 driving the first sub-pixel 112 may be interpretedas that the driving element 120 is electrically connected to the firstsub-pixel 112, and the driving element 120 may enable the firstsub-pixel 112 to display or the driving element 120 may switch a displayfunction of the first sub-pixel 112.

The first sub-pixel 112, the second sub-pixel 114, and the thirdsub-pixel 116 may respectively include a sub-pixel electrode (forexample, a first sub-pixel electrode PE1, a second sub-pixel electrodePE2, and a third sub-pixel electrode PE3), a part of a common electrode,and a corresponding color filter pattern. To be specific, the sub-pixelmay include the sub-pixel electrode and a part of the common electrodeincluded in the array substrate 100A, and the corresponding color filterpattern included in the counter substrate 100S2. Therefore, thearrangement of the first sub-pixel 112, the second sub-pixel 114 and thethird sub-pixel 116 in FIG. 3 may also be interpreted as the arrangementof the sub-pixel electrodes of each sub-pixel. In addition, theso-called sub-pixels may be used to provide a driving electric field ora driving current to drive a display medium (not shown) or a luminescentmaterial (not shown) to present a desired display effect. For example,when the display panel 12 is a liquid crystal display panel, the drivingelectric field provided by the sub-pixels may drive a liquid crystalmaterial so that the liquid crystal material provides a function of alight valve to display an image. When the display panel 12 is aself-luminous display panel, the sub-pixels may provide a drivingcurrent to drive a luminescent material to emit light with a requiredluminous intensity to implement image display. However, thesedescriptions are for example only, and are not intended to limit thescope covered by the disclosure. In addition, the first sub-pixel 112,the second sub-pixel 114 and the third sub-pixel 116 may be used topresent different display colors, so that the display panel 12 mayprovide a full-color display effect.

Moreover, the array substrate 100A further includes signal lines 130 fortransmitting electrical signals. The signal lines 130 may include asignal line 132 for transmitting a scan signal, a signal line 134 fortransmitting a first sub-pixel signal, a signal line 136 fortransmitting a second sub-pixel signal, and a signal line 138 fortransmitting a third sub-pixel signal. The signal lines may beelectrically connected to the driving element 120. In detail, thesub-pixel electrodes in the sub-pixels may be electrically connected tothe signal lines through the driving elements. In this way, thesub-pixels may receive signals through the signal lines. For example,the sub-pixel electrode PE1 in a first sub-pixel 112A may beelectrically connected to the signal lines 132 and 134 through thedriving element 120. In some embodiments, the signal line 132 may be,for example, a scan line, which may extend along the first direction D1.The signal line 134, the signal line 136 and the signal line 138 may be,for example, data lines, and may extend along the second direction D2,where the first direction D1 and the second direction D2 may beintersected.

In some embodiments, the driving element 120 may be turned on or off bysignal control of the signal line 132, and when the driving element 120is turned on, a signal transmitted on the signal line 132 may betransmitted to the first sub-pixel 112. Therefore, the driving element120 is electrically connected to the signal line 132 and the signal line134. Other driving elements not marked in FIG. 3 may be electricallyconnected to the signal line 136 and the signal line 138 respectively,and are also turned on or off by the signal transmitted by the signalline 132, so as to control the second sub-pixel 114 and the thirdsub-pixel 116 to display. In this embodiment, the signal line 134, thesignal line 136 and the signal line 138 may be centrally arranged on oneside of the four pixels 110, and the signal line 132 is arranged on theother side of the four pixels to surround the four pixels. The regionsurrounded by the signal lines 130 may be understood as the pixel blockPX1 in FIG. 2 , but the disclosure is not limited thereto.

In FIG. 3 , one pixel block PX1 includes a first pixel 110A, a secondpixel 110B, a third pixel 110C, and a fourth pixel 110D. The first pixel110A and the second pixel 110B may be arranged adjacent to each otheralong the second direction D2, the second pixel 110B and the third pixel110C may be arranged adjacent to each other along the first directionD1, and the first pixel 110A and the fourth pixel 110D may be arrangedadjacent to each other along the first direction D1. The first pixel110A may include a first sub-pixel 112A, a second sub-pixel 114A and athird sub-pixel 116A, the second pixel 110B may include a firstsub-pixel 112B, a second sub-pixel 114B and a third sub-pixel 116B, thethird pixel 110C may include a first sub-pixel 112C, a second sub-pixel114C, and a third sub-pixel 116C, and the fourth pixel 110D may includea first sub-pixel 112D, a second sub-pixel 114D, and a third sub-pixel116D. However, the number of pixels and the number of sub-pixelsdescribed in this embodiment are only for illustration, and are notintended to limit the scope of the disclosure.

In FIG. 3 , one pixel block PX1 in the display panel is displayed, andfour pixels 110 are arranged in one pixel block. The display panel mayinclude a plurality of repeated pixel blocks PX1. For the convenience ofdescription, only one pixel block is shown in FIG. 3 . The sub-pixels ofthe same color arranged along the second direction D2 may be providedwith signals through a same data line. In detail, the first sub-pixels112 in the first pixel 110A and in the second pixel 110B may have thesame color (for example, red), and may be provided with signals throughthe signal line 134 (data line). The second sub-pixels 114 in the firstpixel 110A and in the second pixel 110B may have the same color (forexample, green) and may be provided with signals through the signal line136 (data line). The third sub-pixels 116 in the first pixel 110A and inthe second pixel 110B may have the same color (for example, blue) andmay be provided with signals through the signal line 138 (data line).

Since the display panel may include a plurality of repeated pixel blocksPX1, there may be repeated signal lines 134, 136, 138 (data lines) on aright side of FIG. 3 that is not shown, and repeated signal lines 132(scan lines) on a top portion of FIG. 3 that is not shown. One pixelblock PX1 may be defined as a region surrounded by adjacent scan linesand adjacent data lines that provide the same color signal. In FIG. 3 ,the adjacent data lines providing the same color signal may be thesignal line 134 and a signal line 134 (data line) that is repeated onthe right side of FIG. 3 which is not shown, both of which providesignals to the first sub-pixel (red). To be specific, in FIG. 3 , thepixel block PX1 may be defined as a region surrounded by the signal line134 (data line), the signal line 134 (data line) repeated on the rightside of FIG. 3 that is not shown, the signal line 132 (scan line), and asignal line 132 (scan line) repeated on the top portion FIG. 3 that isnot shown, for example, a region encircled by the dotted lines.

According to some embodiments, the pixel block PX1 may be defined by thelight-shielding layer 170 in the counter substrate 100S2. Referring toFIG. 3 and FIG. 7 together, a light-shielding layer 170 in the countersubstrate 100S2 is configured at positions corresponding to the signallines 134, 136, 138 and the signal lines 132 in FIG. 3 (FIG. 7 ). Inthis way, the light-shielding layer 170 has an edge 170S1 at thecorresponding position of the signal line 134 (data line), and has anedge 170S2 at the corresponding position of the signal line 132 (scanline). As described above, the display panel may include a plurality ofrepeated pixel blocks PX1, so that on the right side and the top portionof FIG. 7 that are not shown, there are other pixel blocks, which alsohave the same edges 170S1 and 170S2 of the light-shielding layer 170.One pixel block PX1 may be defined as a region surrounded by the edge170S1 of the light-shielding layer 170 configured corresponding to thedata line, a next same edge 170S1 along the first direction D1, an edge170S2 configured corresponding to the scan line, and a next same edge170S2 along the second direction D2, for example, the region encircledby the dotted lines.

In FIG. 3 , the electronic device 10 further includes a first conductiveconnection element 140, and the first sub-pixel electrodes PE1 of thefirst sub-pixels 112 of the plurality of pixels 110 may be electricallyconnected to each other through the first conductive connection element140. In detail, each of the first sub-pixels may include a firstsub-pixel electrode. The plurality of pixels 110 may include the firstpixel 110A and the second pixel 110B, and the first sub-pixel electrodePE1 of the first sub-pixel 112A of the first pixel 110A may beelectrically connected to the first sub-pixel electrode PE1 of the firstsub-pixel 112B of the second pixel 110B through the first conductiveconnection element 140.

For example, the first conductive connection element 140 may include aportion 142, a portion 144 and a portion 146. The portion 142 isconnected between the first sub-pixel electrode PE1 of the firstsub-pixel 112A and the first sub-pixel electrode PE1 of the firstsub-pixel 112B, the portion 144 is connected between the first sub-pixelelectrode PE1 of the first sub-pixel 112B and the first sub-pixelelectrode PE1 of the first sub-pixel 112B, and the portion 146 isconnected between the first sub-pixel electrode PE1 of the firstsub-pixel 112C and the first sub-pixel electrode PE1 of the firstsub-pixel 112D. In this way, the first sub-pixel electrodes PE1 of thefirst sub-pixel 112A, the first sub-pixel 112B, the first sub-pixel 112Cand the first sub-pixel 112D may be electrically connected to each otherin series. According to some embodiments, the portion 142 and theportion 146 may extend along the second direction D2, a part of theportion 144 may extend along the first direction D1, and another part ofthe portion 144 may extend along the second direction D2, but thedisclosure is not limited thereto.

FIG. 4B is a schematic cross-sectional view taken along a line I-I′ anda line II-II′ of FIG. 3 . As shown in FIG. 4B, in a thickness directionD3 of the array substrate 100A, at least a part of the first conductiveconnection element 140 is disposed between the driving element 120 andthe first sub-pixel electrode PE1. According to some embodiments, thefirst conductive connection element 140 may be transparent. The firstconductive connection element 140 may include a transparent material,for example, indium tin oxide (ITO). According to some embodiments, thefirst conductive connection element 140 may be opaque, for example, mayinclude an opaque material, such as metal. According to someembodiments, the first conductive connection element 140 may include atransparent portion and an opaque portion. The portion 142, the portion144 and the portion 146 in the first conductive connection element 140may be made of the same material or different materials. According tosome embodiments, the portion 142, the portion 144, and the portion 146may be made of the same material, and may be a transparent material.According to some embodiments, the portion 142 may be an opaquematerial, and the portions 144 and 146 may be a transparent material. Asshown in FIG. 4B, the part of the signal line 132 (scan line)overlapping an active layer may be used as a gate electrode, and thepart of the signal line 134 (data line) connected to the active layermay be used as a source electrode. In this way, the active layer 220,the gate electrode 132, the source electrode 134, and a drain electrode242 may constitute a thin film transistor, which may be used as aspecific example of the driving element 120. According to someembodiments, the active layer 220 may be a semiconductor such aspolysilicon, amorphous silicon, or indium gallium zinc oxide (IGZO).

The electronic device 10 further includes a second conductive connectionelement 150, and the second sub-pixel electrodes of the secondsub-pixels 114 of the plurality of pixels 110 may be electricallyconnected to each other through the second conductive connection element150. Similar to the first conductive connection element 140 describedabove, in detail, each of the second sub-pixels 114 may include thesecond sub-pixel electrode PE2. The plurality of pixels 110 may includethe first pixel 110A and the second pixel 110B, and the second sub-pixelelectrode PE2 of the second sub-pixel 114A of the first pixel 110A maybe electrically connected to the second sub-pixel electrode PE2 of thesecond sub-pixel 114B of the second pixel 110B through the secondconductive connection element 150. The second conductive connectionelement 150 may include a portion 152 connected between the secondsub-pixel 114A and the second sub-pixel 114B, a portion 154 connectedbetween the second sub-pixel 114B and the second sub-pixel 114C, and aportion 156 connected between the second sub-pixel 114C and the secondsub-pixel 114D. In this way, the second sub-pixel electrode of thesecond sub-pixel 114A, the second sub-pixel electrode of the secondsub-pixel 114B, the second sub-pixel electrode of the second sub-pixel114C, and the second sub-pixel electrode of the second sub-pixel 114Dmay be electrically connected to each other. The portions 152, 154, 156in the second conductive connection element 150 may be made of the samematerial or different materials, and may be of the same layer ordifferent layers. According to some embodiments, the portions 152 and156 may be of the same layer, and the portions 152 and 154 may be ofdifferent layers. In addition, in the thickness direction of the arraysubstrate 100A, at least a part of the second conductive connectionelements 150 may be disposed between the second sub-pixel electrode ofthe second sub-pixel 114A and the corresponding driving element 120, sothat the corresponding driving element 120 may simultaneously drive foursub-pixels of the second sub-pixel 114A, the second sub-pixel 114B, thesecond sub-pixel 114C, and the second sub-pixel 114D. Materials suitablefor the second conductive connection element 150 are similar to those ofthe first conductive connection element 140, and detail thereof is notrepeated.

The electronic device 10 further includes a third conductive connectionelement 160, and the third sub-pixel electrodes of the third sub-pixels116 of the plurality of pixels 110 may be electrically connected to eachother through the third conductive connection element 160. Similar tothe first conductive connection element 140, the third conductiveconnection element 160 may include a portion 162 connected between thethird sub-pixel 116A and the third sub-pixel 116B, a portion 164connected between the third sub-pixel 116B and the third sub-pixel 116C,and a portion 166 connected between the third sub-pixel 116C and thethird sub-pixel 116D. In this way, the third sub-pixel electrode of thethird sub-pixel 116A, the third sub-pixel electrode of the thirdsub-pixel 116B, the third sub-pixel electrode of the third sub-pixel116C, and the third sub-pixel electrode of the third sub-pixel 116D maybe electrically connected to each other. The portions 162, 164, 166 inthe third conductive connection element 160 may be made of the samematerial or different materials, and may be of the same layer ordifferent layers. According to some embodiments, the portions 162 and166 may be of the same layer, and the portions 162 and 164 may be ofdifferent layers. In addition, in the thickness direction of the arraysubstrate 100A, at least a part of the third conductive connectionelements 160 may be disposed between the third sub-pixel electrode ofthe third sub-pixel 116A and the corresponding driving element 120, sothat the corresponding driving element 120 may simultaneously drive foursub-pixels of the third sub-pixel 116A, the third sub-pixel 116B, thethird sub-pixel 116C and the third sub-pixel 116D. Materials suitablefor the third conductive connection element 160 are similar to those ofthe first conductive connection element 140, and detail thereof is notrepeated. The first conductive connection element 140, the secondconductive connection element 150, and the third conductive connectionelement 160 may be made of the same material, or different materials,which are not limited by the disclosure.

In some embodiments, the first pixel 110A, the second pixel 110B, thethird pixel 110C, and the fourth pixel 110D are spaced apart from eachother to form a transparent portion RT among the first pixel 110A, thesecond pixel 110B, the third pixel 110C and the fourth pixel 110D. Thesub-pixel electrodes of all sub-pixels and all conductive connectionelements connected between the sub-pixel electrodes may be made oftransparent conductive materials. According to some embodiments, atleast one of the first conductive connection element 140, the secondconductive connection element 150, and the third conductive connectionelement 160 described above may include a transparent conductivematerial. For example, the first conductive connection element 140 mayinclude a transparent conductive material. In this way, as shown in FIG.3 , although the conductive connection elements extend between thesub-pixels and pass through the transparent portion RT, the conductiveconnection elements do not block light. In other words, the arrangementof the conductive connection elements does not affect the transmissionproperty, which helps to maintain the light transmission property of thedisplay panel in the transparent region R1 of FIG. 2 .

In this embodiment, the portion 144 of the first conductive connectionelement 140 may be overlapped with the second sub-pixel electrode PE2 ofthe second sub-pixel 114B and the third sub-pixel electrode PE3 of thethird sub-pixel 116B. The portion 154 of the second conductiveconnection element 150 may be overlapped with the portion 144 of thefirst conductive connection element 140 and the third sub-pixelelectrode PE3 of the third sub-pixel 116B. The portion 164 of the thirdconductive connection element 160 may be overlapped with the portion 144of the first conductive connection element 140 and the portion 156 ofthe second conductive connection element 150, the first sub-pixelelectrode PE1 of the first sub-pixel 112C and the second sub-pixelelectrode PE2 of the second sub-pixel 116C. Therefore, in thisembodiment, a plurality of transparent conductive layers may be used toform the sub-pixel electrodes and the conductive connection elements.For example, the portion 154 of the second conductive connection element150 and the portion 164 of the third conductive connection element 160may be formed of a same transparent conductive layer (for example, afirst transparent conductive layer). The whole first conductiveconnection element 140, the portion 152 and the portion 156 of thesecond conductive connection element 150 and the portion 162 and theportion 166 of the third conductive connection element 160 may be formedof a same transparent conductive layer (for example, a secondtransparent conductive layer), while the sub-pixel electrodes of thefirst sub-pixel 112, the second sub-pixel 114 and the third sub-pixel116 may be formed of a same transparent conductive layer (for example, athird transparent conductive layer). According to some embodiments, theportion 144 of the first conductive connection element 140 and theportion 156 of the second conductive connection element 150 may be ofdifferent conductive layers, and may have a partial overlap portion.According to some embodiments, the portion 144 of the first conductiveconnection element 140 and the portion 164 of the third conductiveconnection element 150 may be of different conductive layers, and mayhave a partial overlap portion.

FIG. 4A is a schematic cross-sectional view of the array substrate ofFIG. 3 taken along a line A-A′, a line B-B′, and a line C-C′ in someembodiments. FIG. 4B is a schematic cross-sectional view of the arraysubstrate of FIG. 3 along the line I-I′ and the line II-II′ of FIG. 3 insome embodiments. To be specific, the film layers of FIG. 4B aresubstantially the same as the film layers of FIG. 4A, but FIG. 4A andFIG. 4B present cross-sections of different parts. To be specific, FIG.4A may represent a connection relationship between the third sub-pixel116A and the third sub-pixel 116B, and FIG. 4B may represent aconnection relationship between the first sub-pixel 112A and the firstsub-pixel 112B.

In FIG. 4A and FIG. 4B, the array substrate 100A includes a substrate210, an active layer 220, a first metal layer 230, a second metal layer240, a first transparent conductive layer 250, a second transparentconductive layer 260, and a third transparent conductive layer 270 and afourth transparent conductive layer 280. To be specific, the arraysubstrate 100A further includes a shielding layer 290 disposed betweenthe active layer 220 and the substrate 210, and a plurality ofinsulating layers I1-I8 disposed between the above film layers.

The shielding layer 290 is disposed on the substrate 210. The insulatinglayer I1 covers the shielding layer 290. The active layer 220 isdisposed on the insulating layer I1, and the shielding layer 290 isoverlapped with at least a partial region of the active layer 220 in athickness direction. The insulating layer I2 is disposed on the activelayer 220 to cover the active layer 220. The first metal layer 230 isdisposed on the insulating layer I2 and a part of the first metal layer230 may be disposed corresponding to the shielding layer 290 and locatedon two opposite sides of the active layer 220. In some embodiments, thefirst metal layer 230 may be patterned to define the signal line 132 inFIG. 3 , and the part of the signal line 132 overlapping the activelayer 220 may act as a gate electrode. In some embodiments, the firstmetal layer 230 (M1) may be patterned to further define a portion 138Aof the signal line 138 of FIG. 3 . The insulating layer I3 is disposedon the first metal layer 230, and the second metal layer 240 is disposedon the insulating layer I3. The second metal layer 240 (M2) may bepatterned to define a portion 138B of the signal line 134 and the signalline 138 of FIG. 3 that traverse the first metal layer 230. In this way,the signal line 138 may be composed of two metal layers. Although notshown in FIG. 4A and FIG. 4B, the second metal layer 240 may furtherdefine the signal line 136 of FIG. 3 . In addition, the second metallayer 240 further includes a drain electrode 242 and a source electrodeSE integrated in the signal lines 134 and 138. The source electrode SEand the drain electrode 242 may be connected to different parts of theactive layer 220 through corresponding holes (penetrating through theinsulating layer I2 and the insulating layer I3). In this way, as shownin FIG. 3 and FIG. 4B, the active layer 220, a part of the signal line132, a part of the signal line 134 and the drain electrode 242 mayconstitute the driving element 120, such as a thin film transistor. Thethin film transistor described in this embodiment may be used as animplementation of the driving element 120 in FIG. 3 , but the disclosureis not limited thereto. In this embodiment, the driving element 120 ofFIG. 4A is connected to the signal line 138, and the driving element 120of FIG. 4B is connected to the signal line 134, so that the two signallines may be driven independently.

The insulating layer I4 may cover the driving element 120, and the firsttransparent conductive layer 250 may be disposed on the insulating layerI4. The first transparent conductive layer 250 may be patterned todefine the portion 154 of the second conductive connection element 150and the portion 164 of the third conductive connection element 160 inFIG. 3 , although the cross-sections of FIG. 4A and FIG. 4B only showthe portion 164 of the third conductive connection element 164. Theinsulating layer I5 covers the first transparent conductive layer 250and the second transparent conductive layer 260 is disposed on theinsulating layer I5. The second transparent conductive layer 260 may bepatterned to define the entirety of the first conductive connectionelement 140, the portions 152 and 156 of the second conductiveconnection element 150, and the portions 162 and 166 of the thirdconductive connection element 160 in FIG. 3 , although thecross-sections of FIG. 4A and FIG. 4B only show the first conductiveconnection element 140 and the portion 162 of the third conductiveconnection element 160. The insulating layer I6, the insulating layer I7and the insulating layer I8 are sequentially disposed on the secondtransparent conductive layer 260, and a thickness of the insulatinglayer I6 (referred to as a first insulating layer hereinafter) may bethicker than other insulating layers to provide a planarization effect,but the disclosure is not limited thereto.

The third transparent conductive layer 270 is disposed on the insulatinglayer I8. The third transparent conductive layer 270 may be patterned todefine the first sub-pixel electrode PE1 of the first sub-pixel 112, thesecond sub-pixel electrode PE2 of the second sub-pixel 114, and thethird sub-pixel electrode PE3 of the third sub-pixel 116. Thecross-section of FIG. 4A shows the sub-pixel electrode PE3 of the thirdsub-pixel 116A and the sub-pixel electrode PE3 of the third sub-pixel116B defined by the third transparent conductive layer 270, and thecross-section of FIG. 4B shows the sub-pixel electrode PE1 of the firstsub-pixel 112A and the sub-pixel electrode PE1 of the first sub-pixel112B defined by the third transparent conductive layer 270. Moreover,the third transparent conductive layer 270 defines a transparent portionelectrode 276 in the cross-sectional structure of the line C-C′. In thisembodiment, the fourth transparent conductive layer 280 is disposedbetween the insulating layer I7 and the insulating layer I8, and thefourth transparent conductive layer 280 defines a transparent portionelectrode 282 in the cross-sectional structure of the line C-C′. Thetransparent portion electrode 282 may be located in the transparentportion RT of FIG. 2 . In some embodiments, the fourth transparentconductive layer 280 may define a common electrode in the region wherethe sub-pixels are located and may be disposed opposite to thecorresponding sub-pixel electrode, so as to generate a driving electricfield that may drive a display medium.

In this embodiment, the first sub-pixel electrode PE1 of the firstsub-pixel 112A of one of the plurality of pixels 110 (the first pixel110A) may be electrically connected to the first sub-pixel electrode PE1of the first sub-pixel 112B of another one of the plurality of pixels110 (the second pixel 110B) through the first conductive connectionelement 140. The third sub-pixel electrode PE3 of the third sub-pixel116A of one of the plurality of pixels 110 (the first pixel 110A) may beelectrically connected to the third sub-pixel electrode PE3 of the thirdsub-pixel 116B of another one of the plurality of pixels 110 (the secondpixel 110B) through the third conductive connection element 160.

As shown in FIG. 4B, the first insulating layer I6 is disposed betweenthe first sub-pixel electrode PE1 and the first conductive connectionelement 140, and the first insulating layer I6 includes a first holeH61. The first sub-pixel electrode PE1 may be electrically connected tothe first conductive connection element 140 through the first hole H61.In addition, the insulating layer I8 between the first sub-pixelelectrode PE1 and the first conductive connection element 140 furtherincludes a hole H8, and the first sub-pixel electrode PE may beelectrically connected to the first conductive connection element 140through the hole H8. The hole H8 may be located within the first holeH61. The first insulating layer 16 may be a planarization layer and maybe disposed between the driving element 120 and the first sub-pixelelectrode PE1. The first insulating layer I6 may be made of an organicmaterial, an inorganic material, or a combination thereof.

In addition, in order to achieve the required electrical connection, thefirst sub-pixel electrode PE1 of the first sub-pixel 112A and a part ofthe first sub-pixel electrode PE1 of the first sub-pixel 112B may extendto the corresponding first hole H61 to electrically connect thecorresponding first conductive connection element 140. The thirdsub-pixel electrode PE3 of the third sub-pixel 116A and the thirdsub-pixel electrode PE3 of the third sub-pixel 116B may respectivelyextend to the corresponding first hole H61 to electrically connect thecorresponding third conductive connection element 160. Similarly, thesecond conductive connection element 150 and the second sub-pixelelectrode of the respective second sub-pixel 114A may also beelectrically connected to each other by a similar structure.

In addition, as shown in FIG. 4B, the second insulating layer 15 isdisposed under the first insulating layer I6, the second insulatinglayer I5 includes a third hole H5, and the first conductive connectionelement 140 includes a first portion 14P and a second portion 24P, andthe first portion 14P may be electrically connected to the secondportion 24P through the third hole H5.

FIG. 5 is a partial schematic diagram of an array substrate according toan embodiment of the disclosure. To be specific, FIG. 5 shows one of thepixel blocks of the display panel in the transparent region. Thestructure shown in FIG. 5 is substantially the same as that shown inFIG. 3 , and the same component symbols in FIG. 3 and FIG. 5 representthe same components, so description thereof is not repeated herein. Thedifference between the array substrate 100B of FIG. 5 and the arraysubstrate 100A of FIG. 3 is mainly in the layout of the conductiveconnection elements. To be specific, in the array substrate 100B of FIG.5 , the portion 144 of the first conductive connection element 140 maybe overlapped with the portion 154 of the second conductive connectionelement 150, and the portion 164 of the third conductive connectionelement 160 may be overlapped with the portion 146 of the firstconductive connection element 140 and the portion 156 of the secondconductive connection element 150. Therefore, the portion 154 of thesecond conductive connection element 150 and the portion 164 of thethird conductive connection element 160 may be selected from film layersdifferent from those of the first conductive connection element 140 andother portions.

For example, FIG. 6 is a schematic diagram of a cross-sectionalstructure of the array substrate of FIG. 5 taken along a line D-D′, aline E-E′, and a line F-F′ in some embodiments. The structure of FIG. 6is substantially similar to that of FIG. 4B, so that the same referencenumerals in the two embodiments represent the same components, anddescription thereof is not repeated herein. To be specific, thedifference between the embodiment of FIG. 6 and the embodiment of FIG.4B lies in the level relationship of the conductive layers. Thecross-sectional structure of FIG. 6 includes a substrate 210, an activelayer 220, a first metal layer 230, a second metal layer 240, a firsttransparent conductive layer 350, a second transparent conductive layer360, a third transparent conductive layer 370, a fourth transparentconductive layer 380, a shielding layer 290, a third metal layer 390,insulating layers I1-I4, and insulating layers I7-I10. Regarding Theconfiguration relationships of the active layer 220, the first metallayer 230, the second metal layer 240, and the insulating layers I1-I4,in this embodiment, the active layer 220, the first metal layer 230, andthe second metal layer 240 may constitute the driving element 120. Thespecific structure and configuration of the driving element 120 may befound with reference to the description of FIG. 4B, and details thereofare not repeated. In this embodiment, the thicker insulating layer I6 isdirectly disposed on the insulating layer I4, the insulating layer I9and the third metal layer 390 are disposed between the insulating layerI7 and the insulating layer I10, and the insulating layer I10 isdisposed between the insulating layer I9 and the insulating layer I8. Inaddition, in this embodiment, all of the transparent conductive layersare formed on the insulating layer I7 and formed after the thickerinsulating layer I6. In detail, the first transparent conductive layer350, the second transparent conductive layer 360, the third transparentconductive layer 370, and the fourth transparent conductive layer 380are disposed on the first insulating layer I6.

In FIG. 6 , the first transparent conductive layer 350 is disposed onthe insulating layer I7, the insulating layer I9 covers the firsttransparent conductive layer 350, the second transparent conductivelayer 360 is disposed on the insulating layer I9, and the third metallayer 390 is disposed on the on the second transparent conductive layer360. The insulating layer I10 covers the second transparent conductivelayer 360 and the third metal layer 390, and the fourth transparentconductive layer 380 is disposed on the insulating layer I10. Theinsulating layer I8 covers the fourth transparent conductive layer 380,and the third transparent conductive layer 370 is disposed on theinsulating layer I8.

In the cross section taken along the line D-D′, the third sub-pixelelectrode PE3 of the third sub-pixel 116A defined by the thirdtransparent conductive layer 370 may be electrically connected to a partof the third sub-pixel electrode PE3 through the holes H8 and H10 of theinsulating layer I8 and the insulating layer I10, and is electricallyconnected to the portion 162 of the third conductive connection element160 defined by the second transparent conductive layer 360 through thethird metal layer 390. The portion 162 of the third conductiveconnection element 160 defined by the second transparent conductivelayer 360 may be connected to the drain electrode 242 defined by thesecond metal layer 240 through the second hole H62 of the firstinsulating layer I6 and through the hole H9 of the insulating layer I9,so as to achieve the desired electrical connection.

In the cross section taken along the line E-E′, the third sub-pixelelectrode PE3 of the third sub-pixel 116B defined by the thirdtransparent conductive layer 370 may be electrically connected toanother part of the third metal layer 390 through the correspondingholes H8 and H10 in the insulating layer 18 and the insulating layerI10, and is electrically connected to the portion 162 of the thirdconductive connection element 160 defined by the second transparentconductive layer 360 through the third metal layer 390. The portion 162of the third conductive connection element 160 may be electricallyconnected to the portion 164 of the third conductive connection element160 defined by the first transparent conductive layer 350 throughanother hole H9 of the insulating layer I9. In the cross section alongthe line F-F′, the portion 164 of the third conductive connectionelement 160 defined by the first transparent conductive layer 350 may beoverlapped with and traverse the portion 146 of the first conductiveconnection element 140 defined by the second transparent conductivelayer 360. In addition, the fourth transparent conductive layer 380defines a transparent portion electrode 382, and the configuration ofthe transparent portion electrode 382 is substantially similar to theaforementioned transparent portion electrode 282.

As shown in FIG. 6 , the first insulating layer I6 is disposed betweenthe driving element 120 and the first conductive connection element 162.The first insulating layer I6 includes a second hole H62, and the firstconductive connection element 162 is electrically connected to thedriving element 120, for example, electrically connected to the sourceelectrode or the drain electrode 242 of the driving element 120 throughthe second hole H62.

FIG. 7 is a schematic diagram of some components of the countersubstrate 100S2 according to an embodiment of the disclosure. Thecomponents disclosed in FIG. 7 may correspond to the structures in FIG.3 or FIG. 5 to form a display panel, but the disclosure is not limitedthereto. In addition, FIG. 7 substantially shows the pixel blocks of thedisplay panel in the transparent region. To be specific, FIG. 7 showsthe light-shielding layer 170 and the color filter layer 180 of thedisplay panel. The light-shielding layer 170 may be a black matrix. Adistribution of the light-shielding layer 170 may correspond to thedriving element 120 and the signal line 130 in FIG. 3 to cover thedriving element 120 and the signal line 130, and the light-shieldinglayer 170 has a plurality of openings P170, and the sub-pixels may bedefined by the openings P170 of the light-shielding layer 170. Forexample, referring to the lower left of FIG. 7 , the three openings ofthe light-shielding layer 170 define the first sub-pixel P1A, the secondsub-pixel P1B, and the third sub-pixel P1C.

As shown in FIG. 7 , the color filter layer 180 includes a first colorpattern 182, a second

color pattern 184 and a third color pattern 186, and the first colorpattern 182, the second color pattern 184 and the third color pattern186 are respectively within the corresponding openings P170. Withreference of the structures shown in FIG. 3 (or FIG. 5 ) and FIG. 7 ,the first color pattern 182 may be provided in the opening P170corresponding to the first sub-pixel 112, the second color pattern 184may be provided in the opening P170 corresponding to the secondsub-pixel 114, and the third color pattern 186 may be provided in theopening P170 corresponding to the third sub-pixel 116. The first colorpattern 182, the second color pattern 184, and the third color pattern186 may include filter materials of different colors to achieve afull-color display effect. In addition, the light-shielding layer 170may vacate a part of the region to define the transparent portion RT, sothat the display panel has a good light transmission property in thetransparent portion RT. In some embodiments, the light-shielding layer170 and the color filter layer 180 of FIG. 7 may be applied to the pixelblock PX1 in the transparent region R1 of FIG. 2 , and the regions otherthan the light-shielding layer 170 and the color filter layer 180construct the transparent portion RT.

FIG. 8 is a partial schematic diagram of an array substrate according toan embodiment of the disclosure. To be specific, FIG. 8 shows the pixelblocks of the display panel in the transparent region, and the structureshown in FIG. 8 is substantially the same as that shown in FIG. 3 . Thesame components in FIG. 3 and FIG. 8 represent the same components, anddescription thereof is not repeated herein. According to FIG. 8 , thedifference between the array substrate 100C and the array substrate 100Ain FIG. 3 is mainly in the materials of the signal line 132, the signalline 134, the signal line 136, and the signal line 138. The signal line132 may include a transparent conductive material. The signal line 132may be a scan line, which extends along the first direction D1. Thesignal lines 134, 136, and 138 may be data lines, and may extend alongthe second direction D2. The signal line 132 may be electricallyconnected to the driving element 120 and may include a transparentconductive material. To be specific, the signal line 132 includes asegment 132A and a segment 132B, a part of the segment 132A mayconstitute a driving element, and the segment 132B does not constitute adriving element. The segment 132B may include a transparent conductivematerial. Similarly, the signal line 134 may include a segment 134A anda segment 134B, the signal line 136 may include a segment 136A and asegment 136B, and the signal line 138 may include a segment 138A and asegment 138B. The segment 134A is connected between the correspondingdriving element 120 and the segment 134B, the segment 136A is connectedbetween the corresponding driving element 120 and the segment 136B, andthe segment 138A is connected between the corresponding driving element120 and the segment 138B. In addition, the segment 132B, the segment134B, the segment 136B and the segment 138B are all made of transparentconductive materials and all extend to the side of the pixel block.Therefore, the region where the segment 134B, the segment 136B and thesegment 138B are located has light transmittance and may be used as thetransparent portion RT.

FIG. 9 is a schematic diagram of some components of the countersubstrate 100S2 according to an embodiment of the disclosure. Thecounter substrate 100S2 disclosed in FIG. 9 may correspond to the arraysubstrate 100C of FIG. 8 to form the display panel 12, but thedisclosure is not limited thereto. To be specific, FIG. 9 shows thelight-shielding layer 170 and the color filter layer 180 in the countersubstrate 100S2. A distribution of the light-shielding layer 170 maycorrespond to the driving element 120 and the signal line 130 in FIG. 3to cover the driving element 120, the segment 132A of the signal line132, the segment 134A of the signal line 134, the segment 136A of thesignal line 136 and the segment 138A of the signal line 138. Inaddition, a part of the light-shielding layer 170 may be correspondinglydisposed on the periphery of the first sub-pixel 112, the secondsub-pixel 114 and the third sub-pixel 116 to surround a plurality ofopenings P170. The color patterns of the color filter layer 180 arerespectively located in the corresponding openings P170. Referring toFIG. 8 and FIG. 9 together, it is learned that the light-shielding layer170 may not shield the segment 132B, the segment 134B, the segment 136Band the segment 138B so as to increase an area ratio of thelight-transmitting region of the display panel 12. In other words, theregion where the segment 132B, the segment 134B, the segment 136B andthe segment 138B are located may also constitute a part of thetransparent portion RT.

FIG. 10 is a schematic diagram of a cross-sectional structure of thearray substrate of FIG. 8 taken along a line G-G′ and a line H-H′ insome embodiments. The structure of FIG. 10 is substantially similar tothat of FIG. 4B, so that the same reference numerals in the twoembodiments denote the same components, and description thereof is notrepeated herein. To be specific, the cross-sectional structure of FIG.4B includes the substrate 210, the active layer 220, the first metallayer 230, the second metal layer 240, the first transparent conductivelayer 250, the second transparent conductive layer 260, the thirdtransparent conductive layer 270, the shielding layer 290 and theinsulating layers I1-I8, and descriptions in FIG. 4B may be referred forconfiguration positions and corresponding structures of the above filmlayers. The active layer 220, the first metal layer 230, and the secondmetal layer 240 may constitute the driving element 120, and thedescriptions of FIG. 4B may be referred for the specific structure andconfiguration of the driving element 120, which is not repeated herein.The main difference between the cross-sectional structure of FIG. 10 andthe cross-sectional structure of FIG. 4B is that the first transparentconductive layer 250 located between the insulating layer I4 and theinsulating layer I5 further includes the segment 134B of the signal line134, and the second transparent conductive layer 260 located between theinsulating layer I6 and the insulating layer I5 further includes thesegment 132B of the signal line 132.

As shown in FIG. 8 and FIG. 10 , according to some embodiments, at leastone of the signal lines 132, 134, 136, 138 may comprise differentmaterials. For example, at least one of the signal lines 132, 134, 136,138 may include segments composed of a transparent conductive material.In detail, at least one of the signal lines 132, 134, 136, 138 mayinclude different segments, one segment may be made of a metal material,and the other segment may be made of a transparent conductive material.In detail, the segment 132A of the signal line 132 may be a metalmaterial, and is formed by patterning the first metal layer 230, and thesegment 132B may be a transparent material, and is formed by patterningthe second transparent conductive layer 260. The segment 134A of thesignal line 134 may be a metal material and may be formed by patterningthe second metal layer 240, and the segment 134B may be a transparentmaterial and may be formed by patterning the first transparentconductive layer 250. Similarly, the segment 136B of the signal line 136and the segment 138B of the signal line 138 may be transparentmaterials.

In this way, the transparent segment of the signal line does not need tobe shielded by the light-shielding layer 170 in the counter substrate100S2. As shown in FIG. 9 , in the counter substrate 100S2, a region RS1corresponding to the transparent segment 132B of the signal line 132does not need to design the light-shielding layer 170, but mayconstitute a part of the transparent portion RT. Similarly, in thecounter substrate 100S2, a region RS2 corresponding to the transparentsegment 134B of the signal line 134, the transparent segment 136B of thesignal line 136, and the transparent segment 138B of the signal line 138does not need to design the light-shielding layer 170, but mayconstitute a part of the transparent portion RT. In this way, the areaof the transparent portion RT may be made larger, so as to achieve abetter light-transmitting effect.

FIG. 11 is a schematic diagram of partial film layers of thecross-sectional structure of the array substrate of FIG. 8 taken alongthe line G-G′ and the line H-H′ in some embodiments. The structure ofFIG. 11 is substantially similar to that of FIG. 10 , so that the samereference numerals in the two embodiments denote the same components,and description thereof is not repeated herein. To be specific, FIG. 11only shows the film layers between the insulating layer I6 and thesubstrate 210, and the description of FIG. 10 may be referred for thestructure and configuration of the other film layers, which is notrepeated herein.

The main difference between FIG. 11 and FIG. 10 lies in the position ofthe first transparent conductive layer 250. In this embodiment, thefirst transparent conductive layer 250 is disposed on the insulatinglayer 13 and is patterned to define the segment 134B of the signal line134. Meanwhile, the second metal layer 240 is disposed on the firsttransparent conductive layer 250 and is patterned to define the segment134A of the signal line 134, so that the segment 134B formed by thefirst transparent conductive layer 250 is disposed between the segment134A formed by the second metal layer 240 and the insulating layer I3. Apart of the segment 134A of the signal line 134 may contact the activelayer 220 to act as the source electrode SE of the driving element 120.In this way, the source electrode SE is electrically connected to thesignal line 134, and the source electrode SE covers a part of the signalline 134.

In view of the foregoing, in the electronic device of the embodiments ofthe disclosure, the first sub-pixels of the plurality of pixels may beconnected by conductive connection elements, and a single drivingelement may be used to drive each of the first sub-pixels of theplurality of pixels. The numbers of the driving elements and the signallines are thereby reduced, and the light transmittance of the electronicdevice is accordingly improved. According to some embodiments, theelectronic device may include the display panel and the light-sensingelement, and light may reach the light-sensing element through thetransparent region in the display panel. According to some embodiments,the conductive connecting component may include a transparent conductivematerial, which may increase the area of the transparent portion toimprove the light transmittance of the electronic device. According tosome embodiments, the signal line electrically connected to the drivingelement may include a transparent conductive material, which may alsoincrease the area of the transparent portion to achieve an improvedlight-transmitting effect.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the disclosed embodimentswithout departing from the scope or spirit of the disclosure. In view ofthe foregoing, it is intended that the disclosure covers modificationsand variations provided they fall within the scope of the followingclaims and their equivalents.

What is claimed is:
 1. An electronic device, comprising: a first unitcomprising a first sub-unit, a second sub-unit, and a third sub-unit,wherein the first sub-unit of the first unit comprises a firstelectrode; a second unit comprising a first sub-unit, a second sub-unit,and a third sub-unit, wherein the first sub-unit of the second unitcomprises a second electrode; a conductive line, wherein the firstelectrode of the first unit is electrically connected to the secondelectrode of the second unit through the conductive line; and a firstinsulating layer disposed between the first electrode of the first unitand the conductive line, wherein the first insulating layer comprises afirst hole, and the first electrode of the first unit is electricallyconnected to the conductive line through the first hole.
 2. Theelectronic device according to claim 1, further comprising a firstsignal line extending along a first direction, wherein in the firstunit, the first sub-unit, the second sub-unit, and the third sub-unitare disposed along the first direction.
 3. The electronic deviceaccording to claim 2, wherein in the second unit, the first sub-unit,the second sub-unit, and the third sub-unit are disposed along the firstdirection.
 4. The electronic device according to claim 2, wherein thefirst signal line is a scan line.
 5. The electronic device according toclaim 2, further comprising a second signal line extending along asecond direction intersecting the first direction, wherein the firstunit and the second unit are adjacently disposed along the seconddirection.
 6. The electronic device according to claim 5, wherein atleast a portion of the conductive line extends along the seconddirection.
 7. The electronic device according to claim 5, wherein thesecond signal line is a data line.
 8. The electronic device according toclaim 1, wherein in the first unit, the first sub-unit, the secondsub-unit, and the third sub-unit display different colors.
 9. Theelectronic device according to claim 8, wherein the first sub-unit ofthe first unit and the first sub-unit of the second unit display a samecolor.
 10. The electronic device according to claim 1, wherein in thefirst unit, the first sub-unit comprises a first color filter part, thesecond sub-unit comprises a second color filter part, the third sub-unitcomprises a third color filter part.
 11. The electronic device accordingto claim 10, wherein the first color filter part, the second colorfilter part, and the third color filter part are of different colors.12. The electronic device according to claim 1, wherein the electronicdevice comprises a transparent region and another region, and the firstunit and the second unit are disposed in the transparent region.
 13. Theelectronic device according to claim 12, further comprising alight-sensing element disposed in a position corresponding to thetransparent region.
 14. The electronic device according to claim 12,wherein the electronic device comprises another unit disposed in theanother region, and the another unit comprises a first sub-unit, asecond sub-unit, and a third sub-unit.
 15. The electronic deviceaccording to claim 14, wherein an area of the first unit disposed in thetransparent region and an area of the another unit disposed in theanother region are different.
 16. The electronic device according toclaim 12, wherein a transmittance of the transparent region is higherthan a transmittance of the another region.
 17. The electronic deviceaccording to claim 1, wherein the electronic device comprises aself-luminous display panel.